Line Card
16116
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Line Card

Kyocera/AVX

Multilayer and single layer ceramic capacitors, resistors, inductors and power capacitor assemblies. Thin-film ceramic substrates, custom hybrid circuits, lumped element, distributed filters.

MICROWAVE TECHNOLOGY

GaAs and GaN MMIC power amplifiers to 40 GHz, Low noise pHEMT devices, hybrid modules, and connectorized RF amplifiers.

NETWORKS INTERNATIONAL

Custom RF filters: lumped element and component, cavity, ceramic, and crystal. Multiplexers, diplexers, and high frequency switch filter banks.

BC SYSTEMS INC

Custom military power supplies, power control products, EMI filter products and integrated power systems.

RH LABS

Microwave control components and subassemblies: switches, attenuators, mixers, limiters, detectors, phase shifters, and multifunction packages.

HXI

Millimeter wave active components and modules inlcluding: HPAs, LNAs, mixers, Up/ down-converters, and high frequency radio products to 86 GHz.

FLANN MICROWAVE

Precision microwave and millimeter wave passive waveguide components, sub-assemblies, calibration kits, and instrumentation to 500 GHz.

WINCHESTER INTERCONNECT

Standard hermetic connectors and D-type connectors, experts in explosion-bonding dissimilar metals, laser welding, and vacuum brazing. Custom hermetic enclosures.

JFW INDUSTRIES, INC.

Attenuators, RF switches, power dividers, test accessories, and automated test systems.

RENAISSANCE

SMT and connectorized isolators and circulators, switch matrices, splitter/combiners, mixers, and space-qualified products.

FEI

Hi-rel OCXO products for low-G sensitivity applications, CRO and DRO products, and rubidium atomic clocks for PNT and secure communication/SATCOM.

DYNAWAVE

RF & microwave connectors, cable, and integrated cable assemblies. High frequency (DC-65 GHz) to high power (KW). High performance DynaFlex®, D-Flex®, DynaTest™ and ArcTite® cable assemblies.

Nuvotronics

Nuvotronic's revolutionary PolyStrata architecture provides an unprecedented platform for mmWave performance, integration, and miniaturization. Products include switch filter banks and multi-function IMAs for Low-SWaP applications.

Chupond America, INC

High-density board-to-board interconnects, temperatures up to 200 deg C, stack heights down to 1.0mm with signal speeds up to 40 GHz, Pin densities to 0.30mm pitch.